Flip Chip Attachment System - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Flip Chip Assembly System "AFM-15"

For small and medium devices! Industry-leading performance in flip chip bonding.

The "AFM-15" is a flip chip mounting system ideal for small to medium-sized devices. We have identified the needs of production sites from the customer's perspective and turned them into products. This system realizes ideals such as high speed, high reliability, space-saving, and low cost. Additionally, we also offer the "MDM-50," which is optimal for high-precision, small-quantity, and quantitative coating applications. 【Features】 ■ High speed ■ High reliability ■ One of the smallest device sizes in the industry ■ Low-energy bonding ■ Compatible with 12-inch wafer supply *For more details, please refer to the catalog or feel free to contact us.